THERMAL INTERFACE MATERIALS WITH GOOD RELIABILITY
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United States of America Patent
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Issued Date -
Nov 3, 2011
app pub date -
Apr 29, 2011
filing date -
Apr 30, 2010
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Abstract
S Pa, (C) antioxidant, (D) thermal conductive filler and (E) other additive or optional materials. The thermal interface materials placed in between the thermal generating and dissipating devices can effectively barrier water and oxygen penetration, preventing the thermal fillers from degradation and improving the reliability of the devices.
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