Thermal head
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United States of America Patent
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Feb 26, 2013
Grant Date -
Oct 27, 2011
app pub date -
Apr 7, 2011
filing date -
Apr 21, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
A thermal head includes an insulating head substrate, one or a plurality of driver ICs, a plurality of heat generating elements that is arranged on the head substrate in a main scanning direction, a plurality of individual electrodes that is provided on the head substrate at one ends of the respective heat generating elements and connects the respective heat generating elements to the driver ICs, and a common electrode that is provided on the head substrate at the other ends of the respective heat generating elements so as to be common to the heat generating elements. Capacitance adjustment portions, which adjust capacitance difference between the respective individual electrodes so that the capacitance difference is reduced, are formed at a wiring pattern of the individual electrodes.
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