Mounting structure for LEDs, LED assembly, LED assembly socket, method for forming a mounting structure
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United States of America Patent
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Issued Date -
Oct 27, 2011
app pub date -
Jul 21, 2008
filing date -
Aug 2, 2007
priority date (Note) -
Abandoned
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Abstract
A mounting structure for at least one LED has a substrate made of silicon and/or another semiconductor, wherein at least one mounting portion formed in a front surface of the substrate for mounting at least one LED chip thereon, and cooling grooves or channels for a cooling fluid are formed in the substrate, preferably in or beneath a rear surface thereof.
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