METHOD FOR SUBSTANTIALLY UNIFORM COPPER DEPOSITION ONTO SEMICONDUCTOR WAFER

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United States of America Patent

APP PUB NO 20110259752A1
SERIAL NO

13119125

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The methods practiced in an electrochemical deposition apparatus with two or more electrodes, described in earlier inventions, are disclosed. The methods produce uniform copper films with WFNU less than 2.5% on semiconductor wafers bearing a resistive copper seed layer with a thickness ranging from 50 to 9O0 A in a copper sulfate based electrolyte whose conductivity is between 0.02 to 0.8 S/cm.

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Patent Owner(s)

Patent OwnerAddress
ACM RESEARCH (SHANGHAI) INCBUILDING 4 NO 1690 CAI LUN ROAD CHINA (SHANGHAI) PILOT FREE TRADE ZONE PUDONG NEW AREA SHANGHAI 201203 201203

International Classification(s)

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  • 2008 Application Filing Year
  • C25D Class
  • 329 Applications Filed
  • 180 Patents Issued To-Date
  • 54.72 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2008200920102011201220132014201520162017201820190255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
He, Chuan Shanghai, CN 143 1886
Ma, Yue Shanghai, CN 269 3729
Wang, Hui Shanghai, CN 1115 8921
Wang, Xi Shanghai, CN 356 3114

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1512422984211401 - 1011 - 2021 - 3031 - 4041 - 5051 - 6071 - 8081 - 90100 +0102030405060708090100110120130140

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