IN-MOLD COATING COMPOSITION AND IN-MOLD-COATED MOLDED PRODUCT
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United States of America Patent
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Oct 13, 2011
app pub date -
Dec 10, 2009
filing date -
Dec 10, 2008
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[PROBLEMS TO BE SOLVED] There are provided an in-mold coating composition having an excellent adhesion to a thermosetting molding resin or a thermoplastic molding resin and an in-mold-coated molded product formed by coating effectively with a conductive coating film in a mold.[SOLUTION] This invention is an in-mold coating composition characterized by comprising components of (A) at least one selected from a urethane oligomer, an epoxy oligomer, a polyester oligomer and a polyether oligomer each having a (meth)acryloyl group, or an unsaturated polyester resin, (B) a monomer capable of copolymerizing with the (A) component, (C) a conductive particle formed by coating a surface of an inorganic particle with a conductive metal oxide particle, and (D) an organic peroxide polymerization initiator, wherein mass ratios of the (A) and (B) components satisfy (A)/(B)=20/80-80/20, a mass ratio of the (C) component satisfies (C)/{(A)+(B)}=5/100-50/100, and a mass ratio of the (D) component satisfies (D)/{(A)+(B)}=0.1/100-5/100, and an in-mold-coated molded product using the composition.
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