DIAMOND ELECTRODE AND METHOD FOR MANUFACTURING DIAMOND ELECTRODE

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United States of America Patent

APP PUB NO 20110247929A1
SERIAL NO

12998181

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Abstract

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of the substrate. The surfaces of the substrate are covered with a plurality of diamond layers to form the film using repeated steps of forming separate diamond layers with each diamond layer having a thickness of 10 to 30 pm on one of the surfaces of the substrate and then forming a diamond layer having a thickness of 10 to 30 pm on the other surface of the substrate. Thus, it is possible to form a nonporous surface of diamond layer and prevent deterioration of an electrode caused by the separation of a diamond film.

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Patent Owner(s)

Patent OwnerAddress
KURITA WATER INDUSTRIES LTDTOKYO JAPAN TOKYO METROPOLIS
SUMITOMO ELECTRIC HARDMETAL CORPITAMI-SHI HYOGO 664-0016

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ikemiya, Norihito Tokyo, JP 3 63
Nagai, Tatsuo Tokyo, JP 20 117
Yoshida, Katsuhito Hyogo, JP 23 274
Yoshida, Shigeru Hyogo, JP 147 2156

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