SUBSTRATE PROCESSING APPARATUS

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United States of America Patent

APP PUB NO 20110247560A1
SERIAL NO

13130078

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A disclosed substrate processing apparatus comprises a reaction chamber; a substrate supporting portion that is provided in the reaction chamber and configured to support a substrate; and plural catalyst reaction portions that are arranged in the reaction chamber in order to oppose the substrate supporting portion, and configured to produce a reaction gas by allowing a source gas introduced from a gas introduction portion to contact a catalyst and to eject the reaction gas to an inner space of the reaction chamber, thereby processing the substrate supported by the substrate supporting portion with the ejected reaction gas.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 107-6325
NATIONAL UNIVERSITY CORPORATION NAGAOKA UNIVERSITY OF TECHNOLOGY1603-1 KAMITOMIOKA-MACHI NAGAOKA-SHI NIIGATA-KEN 940-2188

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Inoue, Yasunobu Nigata, JP 64 135
Iwabuchi, Katsuhiko Kanagawa, JP 16 847
Nishiyama, Hiroshi Niigata, JP 80 716
Ushijima, Mitsuru Tokyo, JP 14 648
Yasui, Kanji Niigata, JP 5 12

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