CUSTOMIZED METALLIZATION PATTERNS DURING FABRICATION OF SEMICONDUCTOR DEVICES
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United States of America Patent
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Issued Date -
Oct 6, 2011
app pub date -
Dec 10, 2009
filing date -
Dec 11, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Embodiments of the invention are directed to a system and method of depositing material on a polycrystalline semiconductor substrate. The method may comprise detecting characteristics of polycrystalline semiconductor substrate, generating image data of a customized pattern of lines based on the characteristics of the substrate and depositing material from one or more nozzles on the substrate according to the image data of the customized pattern. The characteristics may include grain boundaries of the substrate and spatial variations in sheet resistance and/or the minority carrier lifetime of the substrate.
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