ELECTROLESS PALLADIUM PLATING SOLUTION AND METHOD OF USE
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United States of America Patent
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Issued Date -
Sep 29, 2011
app pub date -
Dec 4, 2009
filing date -
Dec 5, 2008
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Abstract
An electroless palladium plating solution includes a polar solvent, at least one palladium salt, at least one non-nitrogenated complexing agent, an alkaline adjusting agent that adjusts the plating solution to a pH of at least 8.0, and a reducing agent. The plating solution, which is used for forming a layer of palladium on a surface of a substrate, yields a substantially pure palladium deposit on the substrate. Precipitation of reduced palladium in the plating solution is substantially prevented.
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