MANUFACTURING METHOD OF FLAVOR-CONTAINING PARTICLE COMPOSITION
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Sep 29, 2011
app pub date -
Dec 3, 2009
filing date -
Dec 16, 2008
priority date (Note) -
Abandoned
status (Latency Note)
![]() |
A preliminary load of PAIR data current through [] has been loaded. Any more recent PAIR data will be loaded within twenty-four hours. |
PAIR data current through []
A preliminary load of cached data will be loaded soon.
Any more recent PAIR data will be loaded within twenty-four hours.
![]() |
Next PAIR Update Scheduled on [ ] |

Importance

US Family Size
|
Non-US Coverage
|
Abstract
The present invention provides a manufacturing method of a flavor-containing particle composition characterized in that flavor, saccharide, and an oily substance having a softening point of 55 to 90° C. are mixed, the mixture is heated so as to bring the saccharide into a melted or a semi-melted state and then, cooled, solidified and crushed.With the flavor-containing particle composition obtained by the manufacturing method of the present invention, there is no dissipation caused by sublimation of the flavor, the flavor is completely encapsulated, preservation stability of aroma is good, fluidity of the powder is high, blocking is hard to occur even under a high-humidity environment, and moreover, flavor release occurs at desirable timing. Furthermore, by increasing the grain size of the flavor-containing particle composition to some degree, a crispy feeling is provided, and if it is used in a food such as chewing gum, a crunchy, flaky and crispy feeling can be obtained and since flavor is released at the same time, the feeling is new and interesting.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
T HASEGAWA CO LTD | 4-4-14 NIHONBASHI-HONCHO CHUO-KU TOKYO 1038431 ?1038431 |
International Classification(s)

- 2009 Application Filing Year
- A23L Class
- 591 Applications Filed
- 344 Patents Issued To-Date
- 58.21 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Nakamura, Tetsuya | Kanagawa, JP | 217 | 3236 |
# of filed Patents : 217 Total Citations : 3236 | |||
Suzuki, Hisashi | Kanagawa, JP | 94 | 762 |
# of filed Patents : 94 Total Citations : 762 | |||
Yoshida, Shougo | Kanagawa, JP | 42 | 108 |
# of filed Patents : 42 Total Citations : 108 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 4 Citation Count
- A23L Class
- 11.20 % this patent is cited more than
- 14 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
- No Legal Status data available.

Matter Detail

Renewals Detail
