COMPRESSION RESIN SEALING AND MOLDING METHOD FOR ELECTRONIC COMPONENT AND APPARATUS THEREFOR
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United States of America Patent
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Issued Date -
Sep 29, 2011
app pub date -
Sep 25, 2009
filing date -
Sep 30, 2008
priority date (Note) -
Abandoned
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Abstract
A compression resin sealing apparatus includes cooling means (64, 104) for each of an upper die (6) and a lower die (10). A gate nozzle (15) including cooling means (154a) is provided in the upper die (6). A cavity (106) for mounting a single substrate is provided in the lower die (10). In this apparatus, a liquid thermosetting resin material (R) in a required amount is supplied into the cavity (106) through the gate nozzle (15). Then, a substrate is supplied between the upper die (6) and the lower die (10), and the upper die (6) and the lower die (10) are clamped to each other. As a result, an electronic component on the substrate is immersed in the liquid thermosetting resin material (R) in the cavity (106). That is, compression resin molding is performed. Here, a temperature of the liquid thermosetting resin material (R) is controlled by the gate nozzle (15) and the cooling means (154a, 64, 104).
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