POLISHING PAD AND METHOD FOR MAKING THE SAME
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United States of America Patent
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Issued Date -
Sep 15, 2011
app pub date -
May 10, 2010
filing date -
Mar 10, 2010
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Abandoned
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Abstract
The present invention relates to a polishing pad and method for making the same. The polishing pad comprises a plurality of fibers and a high polymeric elastomer compound. The fibers cross each other to form a fabric substrate. The high polymeric elastomer compound includes a first high polymeric elastomer resin and a second high polymeric elastomer resin. The weight-average molecular weight of the first high polymeric elastomer resin is 100,000 to 300,000. The second high polymeric elastomer resin is a two-component high polymeric elastomer resin, and includes a first component and a second component. The first component is polyol with a molecular weight of 1,500 to 2,500 and 1 wt % to 15 wt %. The second component is polyol with a molecular weight of 3,500 to 4,500 and 85 wt % to 99 wt %. Therefore, the polishing pad has better stiffness, a plurality of communicating holes and active fibers, so that a workpiece to be polished will have excellent surface quality.
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