Method for polishing a semiconductor wafer
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United States of America Patent
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Jul 7, 2020
Grant Date -
Sep 15, 2011
app pub date -
Mar 2, 2011
filing date -
Mar 10, 2010
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Abstract
A method of polishing a semiconductor wafer includes polishing a surface of the semiconductor wafer using a polishing pad while supplying a polishing agent slurry containing abrasives during a first step. The polishing pad is free of abrasives and includes a first surface that contacts the semiconductor wafer, the first surface having a surface structure including elevations. Supply of polishing agent slurry is subsequently ended and, in a second step, the surface of the semiconductor wafer is polished using the polishing pad while supplying a polishing agent solution having a pH value of at least 12 that is free of solids.
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