SELEGILINE-CONTAINING ADHESIVE PREPARATION

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20110223236A1
SERIAL NO

13045635

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention provides an adhesive preparation, which includes a backing and a pressure-sensitive adhesive layer formed on at least one side of the backing, the pressure-sensitive adhesive layer containing (−)-(R)—N,α-dimethyl-N-2-propynylphenethylamine and/or a pharmaceutically acceptable salt thereof, a pressure-sensitive adhesive and a component which is liquid at 25° C. and has two or more ester bonds in one molecule thereof.

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Patent Owner(s)

Patent OwnerAddress
NITTO DENKO CORPORATION1-1-2 SHIMOHOZUMI IBARAKI-SHI OSAKA 5678680 ?5678680
FUJIMOTO CO LTDMATSUBARA-SHI OSAKA 580-0011

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AMEYAMA, Satoshi Osaka, JP 11 8
HORI, Mitsuhiko Osaka, JP 64 341
HOSAKA, Kyoko Osaka, JP 1 0
KAMIYAMA, Masashi Osaka, JP 3 117
MARUO, Hiroki Osaka, JP 23 135
NAKAMURA, Koji Osaka, JP 269 3092
NISHIURA, Eri Osaka, JP 2 0

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