OPTOELECTRONIC TRANSISTOR OUTLINE (TO)-CAN HEADER ASSEMBLY HAVING A CONFIGURATION THAT IMPROVES HEAT DISSIPATION AND REDUCES THERMAL RESISTANCE
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United States of America Patent
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Issued Date -
Sep 15, 2011
app pub date -
Mar 9, 2010
filing date -
Mar 9, 2010
priority date (Note) -
Abandoned
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Abstract
A TO-can header assembly is provided that has improved heat dissipation and thermal resistance characteristics. The TO-can header assembly includes a relatively large ceramic heat dissipation block that functions as both a carrier for the laser diode and as a heat dissipation device. The ceramic heat dissipation block is in contact with the upper mounting surface of the header to allow a relatively large amount of heat to quickly pass from the laser diode through the heat dissipation block and into the upper mounting surface of the header. The cylindrical side wall of the header is smooth, rather than notched, and at least a substantial portion of the smooth cylindrical side wall is in continuous contact with an external heat sink device. Heat moves rapidly from the header into the external heat sink device where it is dissipated, thereby reducing the thermal resistance of the header.
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