OPTOELECTRONIC TRANSISTOR OUTLINE (TO)-CAN HEADER ASSEMBLY HAVING A CONFIGURATION THAT IMPROVES HEAT DISSIPATION AND REDUCES THERMAL RESISTANCE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20110222567A1
SERIAL NO

12720043

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Abstract

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A TO-can header assembly is provided that has improved heat dissipation and thermal resistance characteristics. The TO-can header assembly includes a relatively large ceramic heat dissipation block that functions as both a carrier for the laser diode and as a heat dissipation device. The ceramic heat dissipation block is in contact with the upper mounting surface of the header to allow a relatively large amount of heat to quickly pass from the laser diode through the heat dissipation block and into the upper mounting surface of the header. The cylindrical side wall of the header is smooth, rather than notched, and at least a substantial portion of the smooth cylindrical side wall is in continuous contact with an external heat sink device. Heat moves rapidly from the header into the external heat sink device where it is dissipated, thereby reducing the thermal resistance of the header.

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Patent Owner(s)

Patent OwnerAddress
AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE LTDNO 1 YISHUN AVENUE 7 SINGAPORE 768923

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Genisio, Stefano Torino, IT 4 29
Scofet, Marco Rivarolo Canavese, IT 11 74
Tallone, Luigi Paesana, IT 20 136

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