METHOD FOR MEASURING THE THICKNESS OF A DISCOIDAL WORKPIECE
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United States of America Patent
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Issued Date -
Sep 15, 2011
app pub date -
Aug 29, 2009
filing date -
Oct 1, 2008
priority date (Note) -
Abandoned
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Abstract
The invention relates to a method for measuring the thickness of a discoidal workpiece, which serves as a substrate for electronic components, comprising the steps: infrared radiation is directed at the top side of the workpiece, wherein a first radiation portion is reflected on the top side and a second radiation portion penetrates the workpiece thickness, is reflected on the bottom side of the workpiece and emerges again on the top side of the workpiece, the first and the second radiation portion interfere under formation of an interference pattern and the optical workpiece thickness between the top side of the workpiece and the bottom side of the workpiece is determined using the interference pattern. It is provided according to the invention that the mechanical workpiece thickness is determined from a measurement of the intensity of the infrared radiation reflected and/or transmitted from the workpiece.
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