METHOD OF MANUFACTURING PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED TIMEPIECE
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United States of America Patent
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Issued Date -
Sep 15, 2011
app pub date -
Mar 14, 2011
filing date -
Mar 15, 2010
priority date (Note) -
Abandoned
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Abstract
Provided are a method of manufacturing a package capable of forming a penetration electrode without conduction defects while maintaining the airtightness of a cavity, a piezoelectric vibrator manufactured by the manufacturing method, and an oscillator, an electronic apparatus, and a radio-controlled timepiece each having the piezoelectric vibrator. A penetration electrode forming step includes: a penetration hole forming step of forming a penetration hole in a base substrate wafer (first substrate); a first paste material filling step of filling a first paste material in the penetration hole and temporarily drying the first paste material; and a second paste material filling step of filling a second paste material in the penetration hole so as to be overlapped on the first paste material. The first paste material has a viscosity lower than the second paste material.
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