Reducing Adhesion between a Conformable Region and a Mold
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United States of America Patent
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app pub date -
May 12, 2011
filing date -
Nov 24, 2004
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Abstract
Improved preferential adhesion and release characteristics are described with respect to a substrate and a mold having imprinting material disposed therebetween, in the absence of an a priori release layer on the mold. The imprinting material is a polymerizable material including a fluorinated surfactant and a photoinitiator. The surfactant includes --CH.sub.2CH.sub.2CH.sub.2O--, --CH(CH.sub.3)CH.sub.2O--, --OCH(CH.sub.3)CH.sub.2--, --CH(CH.sub.3)CH(CH.sub.3)O--, or a combination thereof.
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