MULTI-CHIP INTEGRATED CIRCUIT
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United States of America Patent
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app pub date -
Mar 3, 2010
filing date -
Mar 3, 2010
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Abstract
An integrated circuit (IC) combines a first IC chip (die) having a first on-chip interconnect structure and a second IC chip having a second on-chip interconnect structure on a reconstructed wafer base. The second IC chip is edge-bonded to the first IC chip with oxide-to-oxide edge bonding. A chip-to-chip interconnect structure electrically couples the first IC chip and the second IC chip.
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