LED PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Sep 8, 2011
app pub date -
Jan 11, 2011
filing date -
Mar 8, 2010
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Abandoned
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Abstract
An LED package structure for increasing heat-dissipating efficiency includes providing a substrate element; removing one part of the substrate element in order to form at least two substrate bodies separated from each other and at least one gap between the at least two substrate bodies; forming at least one
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