PRETREATING AGENT FOR ELECTROPLATING, PRETREATMENT METHOD FOR ELECTROPLATING, AND ELECTROPLATING METHOD
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United States of America Patent
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Issued Date -
Sep 8, 2011
app pub date -
Mar 1, 2011
filing date -
Mar 2, 2010
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Abandoned
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Abstract
A pretreating agent for electroplating includes an aqueous solution containing, as essential ingredient, (A) at least one anti-adsorption agent selected from among a triazole compound, a pyrazole compound, an imidazole compound, a cationic surfactant, and an amphoteric surfactant, and (B) chloride ion. The pretreating agent does not impair adhesion between substrate copper and a photoresist, and does not damage adhesion between the substrate copper and an electrolytic copper plating film.
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