INSULATION RESIN COMPOSITION RESISTANT TO THERMAL DEFORMATION AND CABLE USING THE SAME
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United States of America Patent
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Issued Date -
Sep 8, 2011
app pub date -
Sep 2, 2010
filing date -
Mar 3, 2010
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Abandoned
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Abstract
Disclosed is an insulation resin composition resistant to thermal deformation comprising an ethylene copolymer base resin having crystallinity between 1% and 30%, not including 30%; and 0.5 to 20 parts by weight of an organic peroxide-based crosslinking agent per 100 parts by weight of the base resin, and a cable using the same. The insulation is resistant to thermal deformation that may occur after a crosslinking process under high temperature and high pressure subsequently to extrusion of a sheath.
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