MOLDED TRANSPARENT RESIN AND PROCESS FOR PRODUCING THE SAME
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United States of America Patent
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Issued Date -
Sep 1, 2011
app pub date -
Aug 2, 2010
filing date -
Aug 31, 2009
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Abandoned
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Abstract
The present invention provides a clear resin molded body which has high heat resistance that can be used in the reflow soldering process using Pb-free solder, which has high transparency that can be used for an optical member, and which can be easily produced, and also provides a method of producing the same.A clear resin molded body includes a molded body of a resin composition composed of a carbon-hydrogen-bond-containing fluororesin, in which the resin composition is crosslinked by irradiating the molded body with ionizing radiation at least once in an atmosphere at a temperature lower than the melting point of the fluororesin and at least once in an atmosphere at a temperature equal to or higher than the melting point of the fluororesin. A method produces the clear resin molded body.
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