METHODS FOR DETECTING METAL PRECIPITATES IN A SEMICONDUCTOR WAFER
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United States of America Patent
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May 11, 2011
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Dec 23, 2009
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Abstract
Methods are disclosed for monitoring the amount of metal contamination imparted during wafer processing operations such as polishing and cleaning. The methods include subjecting a silicon-on-insulator structure to the semiconductor process, precipitating metal contamination in the structure and delineating the metal contaminants.
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