High-Field Anodizing Apparatus
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United States of America Patent
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Issued Date -
Sep 1, 2011
app pub date -
Apr 27, 2011
filing date -
Oct 1, 2009
priority date (Note) -
Abandoned
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Abstract
Disclosed herein is a high-field anodizing apparatus, in which nanostructures are formed on a surface of a metal by immersing a metal anode and a counter electrode into an electrolyte charged in an anodizing cell to oxidize the metal, comprising: a power supply unit for applying a predetermined pattern of voltage between the metal anode and counter electrode in the electrolyte; a temperature control unit for maintaining the temperature of the metal anode, counter electrode and electrolyte constant; and a reaction rate control unit for measuring the value of current generated by the voltage supplied by the power supply unit and controlling the concentration of the electrolyte using the current value to maintain the current constant. The high-field anodizing apparatus is advantageous in that it is possible to prevent the damage of nanostructures caused by the rapid melting of a metal or the dielectric breakdown of an oxide film attributable to high-field anodization and to control the growth rate of nanostructures, thus greatly improving the productivity of nanostructures.
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