PROCESS FOR PRODUCING SUBSTRATE HAVING PATTERNED CONDUCTIVE POLYMER FILM AND SUBSTRATE HAVING PATTERNED CONDUCTIVE POLYMER FILM

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United States of America Patent

APP PUB NO 20110209906A1
SERIAL NO

13127729

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Abstract

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A process for producing a substrate having a patterned conductive polymer film is provided in which stripping properties are excellent, and discoloration of an end part of the conductive polymer film when a resist film is stripped from the conductive polymer film is suppressed. The process for producing a substrate having a patterned conductive polymer film includes in sequence a step of forming a substrate having in order above the substrate a conductive polymer film and a patterned resist film, a step of etching the conductive polymer film in accordance with the resist film pattern, and a step of stripping the resist film above the conductive polymer film by means of a stripping liquid, the stripping liquid containing an organic solvent (A) at 5 to 40 wt % selected from the group consisting of an N-alkylpyrrolidone, a carboxylic acid amide compound, a dialkyl sulfoxide, and an ether compound and an organic solvent (B) at 60 to 95 wt % selected from the group consisting of an alkyrolactone, an alkylene carbonate, and a polyhydric alcohol.

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Patent Owner(s)

Patent OwnerAddress
TOAGOSEI CO LTD1-14-1 NISHI-SHIMBASHI MINATO-KU TOKYO 1058419 ?1058419
TSURUMI SODA CO LTD1-7 SUEHIRO-CHO TSURUMI-KU YOKOHAMA-SHI KANAGAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ihara, Takashi Aichi, JP 27 196

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