Halogen-Free Dielectric Composition For use As Dielectric Layer In Circuitized Substrates
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United States of America Patent
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Issued Date -
Aug 25, 2011
app pub date -
Feb 25, 2010
filing date -
Feb 25, 2010
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Abandoned
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Abstract
A dielectric composition for forming a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like. The composition includes at least three resins: a halogen-free flame retardant, methyl ethyl ketone (prior to final layer formation), manganese octoate, and a coupling agent. The composition does not include a halogen or a fluoropolymer as part thereof. Dielectric layers formed from the composition are capable of withstanding the relatively high temperatures associated with lead-free solder applications. The composition may or may not include inorganic filler as part thereof.
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