SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

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United States of America Patent

APP PUB NO 20110201159A1
SERIAL NO

13123385

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Abstract

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exposed by the etching, and further reducing a total manufacturing cost.

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Patent Owner(s)

Patent OwnerAddress
MITSUI HIGH-TEC INCFUKUOKA PREFECTURE FUKUOKA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mori, Shuji Fukuoka, JP 18 87
Nishimura, Nozomi Fukuoka, JP 5 72
Shimizu, Koji Fukuoka, JP 159 2248

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