LAMINATE AND PROCESS FOR PRODUCING THE LAMINATE
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United States of America Patent
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Issued Date -
Aug 18, 2011
app pub date -
Aug 20, 2009
filing date -
Aug 25, 2008
priority date (Note) -
Abandoned
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Abstract
A laminate including a resin layer and a metal layer, the resin layer being obtained by modifying at least part of the surface of a resin film including a thermoplastic cyclic olefin resin by ionizing irradiation, and the metal layer being formed on the modified area of the surface of the resin film by plating, a method of producing the same, and an electronic circuit board including a circuit formed by etching the metal layer of the laminate by photolithography, are disclosed. The laminate ensures that the insulating resin layer (flat surface) exhibits high adhesion to the conductor layer.
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