Heat-reactive resist material, layered product for thermal lithography using the material, and method of manufacturing a mold using the material and layered product

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United States of America Patent

PATENT NO 9257142
APP PUB NO 20110195142A1
SERIAL NO

13123854

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A heat-reactive resist material of the invention is characterized in that the boiling point of the fluoride of the element is 200° C. or more. By this means, it is possible to achieve the heat-reactive resist material having high resistance to dry etching using fluorocarbons to form a pattern with the deep groove depth.

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Patent Owner(s)

Patent OwnerAddress
ASAHI KASEI E-MATERIALS CORPORATION1-105 KANDA JINBOCHO CHIYODA-KU TOKYO 1018101 ?1018101

International Classification(s)

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  • 2009 Application Filing Year
  • B82Y Class
  • 782 Applications Filed
  • 312 Patents Issued To-Date
  • 39.90 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances200920102011201220132014201520162017201820192020202120220255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Furuya, Kazuyuki Tokyo, JP 8 87
Maeda, Masatoshi Tokyo, JP 31 534
Mitamura, Yoshimichi Tokyo, JP 13 106
Nakagawa, Norikiyo Tokyo, JP 6 33

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