CONDUCTIVE PASTE COMPOSITION
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United States of America Patent
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Issued Date -
Aug 11, 2011
app pub date -
Aug 28, 2009
filing date -
Aug 29, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention relates to a conductive paste composition. The conductive paste composition includes a binder resin including a urethane group present in a main chain or a side chain, especially a binder resin formed from isocyanate and a polymer with at least one hydroxyl group, a fine powder, a glass frit, and a solvent. The conductive paste composition can have a superior physical property, improve productivity and an environmental problem by reducing waste fluid such as aqueous alkaline solution, and form a fine pattern having an improved structure. Accordingly, the paste composition is especially useful for a paste for gravure offset printing.
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