TEMPERATURE CONDITIONING SYSTEM METHOD TO OPTIMIZE VAPORIZATION APPLIED TO COOLING SYSTEM
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United States of America Patent
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Issued Date -
Aug 11, 2011
app pub date -
Jan 7, 2011
filing date -
Jan 7, 2010
priority date (Note) -
Abandoned
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Abstract
Described herein is for a system and procedure to apply vaporization for heat transfer processes, particularly condensers in air conditioning and refrigeration systems both for upgrading units using the discontinued R22 refrigerant and for new equipments. The application can be applied to other cooling processes such as computer chip cooling, garments for medical, personal garments for military personnel. The application points to the features of different manifestations of vaporization for cooling in both natural and other equipments. The process can be extended for small and compact implementation on new equipments with maintenance improvement compared to water tower coolers, lower capitalization costs, modularity and ease of maintenance, and indoor installations enabling extension of capability of the cooling system with application of air flow condition. The advantages and implementation on new equipments for residential, industrial and large cooling units enable several advantages both economic, reliability, maintainability, indoor operation, reduction of cost of scaling problems and flexibility. Many additional applications are possible and are discussed herein, including high power computer chip cooling.
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