SEMICONDUCTOR DEVICE WITH A VARIABLE INTEGRATED CIRCUIT CHIP BUMP PITCH
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United States of America Patent
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Issued Date -
Aug 4, 2011
app pub date -
Feb 3, 2010
filing date -
Feb 3, 2010
priority date (Note) -
Abandoned
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Abstract
A semiconductor device is described that comprises an integrated circuit substrate comprising a plurality of bonding pads for enabling electrical connectivity to a chip circuit. The bonding pads are at least partially covered by a passivation layer having pre-manufactured holes. The device also includes a chip having a plurality of bumps atop the bonding pads, wherein areas of the bumps are larger than respective areas of cooperating holes in the passivation layer.
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