APPARATUS AND METHOD FOR LAMINATING A FILM ON A WAFER
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United States of America Patent
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Issued Date -
Aug 4, 2011
app pub date -
Feb 3, 2010
filing date -
Feb 3, 2010
priority date (Note) -
Abandoned
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Abstract
A method for laminating a film on a wafer includes a pre-cutting step: pre-cutting a dry film for fitting a size wafer size; a pre-attaching step: moving and pre-attaching the cut dry film on the wafer for corresponding the cut dry film and the wafer; a laminating step: laminating the cut dry film on the wafer with heating for fixing the cut dry film on the wafer. A flattening step: vertically and rigidly laminating the cut dry film on the wafer with heating again for flattening the cut dry film on the wafer.
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