Heat Sealable Packaging Material with Improved Hot Tack
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United States of America Patent
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Issued Date -
Aug 4, 2011
app pub date -
Jan 27, 2011
filing date -
Feb 1, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A packaging material includes a substrate and a heat seal layer. The heat seal layer comprises polyvinylidene chloride. The packaging material includes at least about 8 wt % moisture for increasing the hot tack of a seal formed between a first portion of the heat seal layer and a second portion of the heat seal layer relative to a packaging material with less than about 8 wt % moisture. If desired, the packaging material including the at least about 8 wt % moisture may be formed into a roll.
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