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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
DUPONT ELECTRONIC MATERIALS HOLDING INC	451 BELLEVUE ROAD NEWARK DE 19713

International Classification(s)

• C09K:MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED ....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Esbenshade, John	Clayton, US	2	4
Geiger, Andrew M	Newark, US	3	6
Libbers, Paul	Claymont, US	2	4
November, Samuel J	Newtown, US	5	38
Sacchetti, Paul J	Warrington, US	4	8
Tracy, Jonathan	Kennett Square, US	13	20
Verbaro, David	Cinnaminson, US	3	4
Watkins, Michael E	Bear, US	2	4

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
February 21, 2012	US,8118897,B2   US8118897B2	GRANTED PATENT AS SECOND PUBLICATION
August 04, 2011	US,20110185967,A1   US20110185967A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent Application No: 2011/0185,967

Mix head assembly for forming chemical mechanical polishing pads

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