COOLING SYSTEM FOR ELECTRONIC APPARATUS

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20110185758A1
SERIAL NO

13020160

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A cooling system for an electronic apparatus, includes: a casing in which the electronic apparatus is housed; an evaporator which is disposed at a rear surface side of the casing, and cools heat released from the electronic apparatus by a refrigerant; a slide mechanism which connects the casing and the evaporator to be movable in a longitudinal direction with respect to the casing; at least any one of a cooling tower which is provided at a higher place than the evaporator and condenses the refrigerant by cooling of external air and sprinkled water, and a heat exchanger which cools the refrigerant by using chilled water; a circulation line which moves the refrigerant between the evaporator and at least one of the cooling tower and the heat exchanger; and a piping which connects the circulation line and the evaporator, and is extendable and contractible in response to movement of the evaporator.

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Patent Owner(s)

Patent OwnerAddress
HITACHI PLANT TECHNOLOGIES LTDTOKYO JAPAN TOKYO METROPOLIS

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ITO, Junichi Tokyo, JP 211 3416
KASHIRAJIMA, Yasuhiro Tokyo, JP 17 305
NAGATAKIYA, A sahi Tokyo, JP 1 6
SENDA, Masakatsu Tokyo, JP 12 129
SHIMOKAWA, Ryoji Tokyo, JP 5 72

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