METHOD OF SHEARING THIN PLATE
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United States of America Patent
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Issued Date -
Jul 21, 2011
app pub date -
Jul 31, 2009
filing date -
Jul 31, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Provided is a method of shearing a thin plate with high quality without a need for narrowing a clearance by precision machining. The method comprises: placing a thin plate (1) having at least one non-metal layer (1b), between a punch (3) and a die (2) having a shearing hole (2a); and relatively moving the punch (3) toward and with respect to the shearing hole (2a) to thereby shear the thin plate (1), wherein the relative movement of the punch (3) is stopped to complete the shearing, before the punch (3) penetrates through the thin plate (1) and becomes fitted into the shearing hole (2a).
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