MODULAR COOLING SYSTEM
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United States of America Patent
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Issued Date -
Jul 14, 2011
app pub date -
Sep 30, 2009
filing date -
Sep 30, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A heat exchange unit for use in a modular heat exchange system including at least one first heat exchanger having a closed circuit for cooling fluid at least one air cooler located upstream of the first heat exchanger, and at least one first fan arrangement operable to cause air to pass through the at least one air cooler and the at least one first heat exchanger, at least one channel providing cooling fluid interconnection between the first heat exchanger and, when in use in the modular heat exchange system, a heat exchanger in at least one other heat exchange unit.
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