COPPER CLAD LAMINATE AND IMPREGNATION LIQUID FOR MAKING THE SAME

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United States of America Patent

APP PUB NO 20110159761A1
SERIAL NO

12649065

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Abstract

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A copper clad laminate includes a glass fiber substrate and at least a copper foil on the glass fiber substrate. The glass fiber substrate is made by impregnating glass fiber fabrics in an impregnation liquid to form prepregs, and then the prepregs are laid up with a copper foil to form the copper clad laminate by a hot press molding. The impregnation liquid includes resin and a filler in a range between 5 PHR and 80 PHR, wherein the filler includes silica and at least a metallic oxide, of which a metallic atom is selected from the groups IIA or IIIA elements in the periodic table, to form a composite material with an amorphous network structure that the copper clad laminate will have a suitable hardness and a coefficient of thermal expansion.

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Patent Owner(s)

Patent OwnerAddress
MSI COMPUTER (SHENZHEN) CO LTD518108 GUANGDONG CITY OF SHENZHEN PROVINCE SHIYAN TOWN TANGTOU VILLAGE LONGMA INFORMATION TECHNOLOGY INDUSTRIAL PARK SHENZHEN CITY GUANGDONG PROVINCE 518108

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chou, CC Hsinchu County, TW 1 2
Ho, Peter Taichung County, TW 86 2211
Tang, Willis Taichung City, TW 1 2
Yang, Joseph Taipei City, TW 44 1185

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