Importance

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Abstract

A method is provided for connecting an integrated circuit to a surface of a printed wiring board. The integrated circuit includes lead contacts and leadless contact pads. A first solder paste is applied to the leadless contact pads of the integrated circuit, and preformed conductive pieces are placed on the first solder paste. The preformed conductive pieces are slugs that have, for example, a cylindrical shape or a rectangular cross-section. The preformed conductive pieces are heated and brought into electrical contact with the leadless contact pads. The lead contacts are formed into gull wings. The bases of the preformed conductive pieces are generally aligned in a plane, and the bases of the gull wings are substantially coplanar with the plane such that they collectively generally define a contact plane. A second solder paste is applied on the surface, and the bases of the gull wings and the preformed conductive pieces are soldered to the second solder paste on the surface so that the integrated circuit is in electrical contact with the surface through both the leadless contact pads and the lead contacts. The preformed conductive pieces comprise a conductive material (e.g., a copper alloy) that has a higher melting point than the first solder paste and the second solder paste such that the preformed conductive pieces do not melt during heating or soldering that is described above.

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First Claim