METHOD AND SYSTEM FOR TRACING DIE AT UNIT LEVEL
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United States of America Patent
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Issued Date -
Jun 30, 2011
app pub date -
Dec 31, 2009
filing date -
Dec 31, 2009
priority date (Note) -
Abandoned
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Abstract
A method and system for tracing die at unit level, comprising: assigning a first identification to a support member including a plurality of die support units; generating a second identification corresponding to a die support unit, the second identification including the first identification and a coordinate of the die support unit within the support member; correlating the second identification to a third identification of a die; attaching the die to the die support unit to generate a packaged die; and assigning the second identification to the packaged die.
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