FINE METAL PARTICLE-CONTAINING COMPOSITION AND METHOD FOR MANUFACTURING THE SAME

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20110155968A1
SERIAL NO

12999819

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Abstract

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is the density of the fine metal particles in a bulk form. An organic material having a molecular weight of 200 or less is caused to adhere to the fine metal particles. The metal-containing composition is manufactured by: a step of preparing a solution by mixing water, ammonia water, an organic material having a molecular weight of 200 or less, and a reducing agent; a step of adding an aqueous solution of a metal salt to the prepared reducing solution to allow the reaction to occur; and a step of filtrating the obtained product and washing the product with water.

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Patent Owner(s)

Patent OwnerAddress
DOWA ELECTRONICS MATERIALS CO LTDTOKYO TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hisaeda, Yutaka Okayama, JP 16 116
Iha, Kosuke Okayama, JP 3 24
Ueyama, Toshihiko Okayama, JP 40 143

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