Method and apparatus for scoring or skiving a solder dam
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United States of America Patent
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Issued Date -
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app pub date -
Mar 31, 2010
filing date -
Dec 30, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present disclosure provides for scoring a line on metal to form a solder dam to define a solderable area on a metal surface. The solderable area can define solderable pads on a solid copper plane or at the end point of a trace on a circuit board. The present disclosure provides for soldering metallic surfaces together and for aligning solderable objects to one another. The surface tension of solder enables the parts to be aligned through the manipulations of the skived patterns and their placement. The skiving can be done either by laser skiving or by mechanical scoring on the metallic surfaces.
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- 14 Age