PRESTRESS STRUCTURAL MATERIAL FORMED BY REORGANIZATION WITH POLYGONAL ORIGINAL BAMBOO AND THE MANUFACTURING METHOD

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United States of America Patent

APP PUB NO 20110151172A1
SERIAL NO

13059697

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention provides a prestress structural material formed by reorganization with polygonal bamboo units and the manufacturing method for it, the manufacturing method includes manufacturing substrate of prestress structural material formed by reorganization with polygonal bamboo units, and the adding of reinforcement material. Bamboo unit undergoes boiling with chemical solution, drying, and then milling the unit on its outer surface, in order to make it become polygonal bamboo segment, arranging abreast side by side in cross-section direction and longitudinally elongating by finger joints, after all, the substrate of prestress structural material formed by polygonal original bamboo units is formed; after those, extending the lacing wire through all or part of bamboo unit of substrate, and the high-strength baffles are disposed on both ends of substrate, fastening both ends of tautened substrate on baffles by anchors or nuts, allowing the lacing wire act as reinforcement material, then the prestress structural material is formed. The invention makes full use of the structure and physical characteristic of original bamboo, and the prestressed effect generated by lacing wire, the environmental friendly structural material with high-intensity, large span, low power, which effectively alleviates the contradiction between China's timber supply and demand, and partially substitutes for concrete and steel materials, it has broad development prospect.

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Patent Owner(s)

Patent OwnerAddress
BEIJING FORESTRY MACHINERY RESEARCH INSTITUTE OF THE FORESTRY ADMINISTRATIONXINGYUAN CENTURY BUILDING NO 20 ANYUAN ROAD CHAOYANG DISTRICT BEIJING 100029

International Classification(s)

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  • 2009 Application Filing Year
  • B27J Class
  • 2 Applications Filed
  • 1 Patents Issued To-Date
  • 50 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2009201020112012201320140255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fu, Wansi Beijing, CN 1 1
Yu, Ying Beijing, CN 77 476
Zhou, Jianbo Beijing, CN 30 1220

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  • 1 Citation Count
  • B27J Class
  • 0 % this patent is cited more than
  • 14 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges321 - 1021 - 3000.20.40.60.811.21.41.61.822.22.42.62.833.2

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