ETCHING METHOD, METHOD FOR MANUFACTURING MICROSTRUCTURE, AND ETCHING APPARATUS

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United States of America Patent

APP PUB NO 20110143549A1
SERIAL NO

12963187

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Abstract

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In one embodiment, an etching method is disclosed. The method can include producing an oxidizing substance by electrolyzing a sulfuric acid solution, and producing an etching solution having a prescribed oxidizing species concentration by controlling a produced amount of the produced oxidizing substance. The method can include supplying the produced etching solution to a surface of a workpiece.

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Patent Owner(s)

Patent OwnerAddress
PERMELEC ELECTRODE LTDKANAGAWA JAPAN KANAGAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Domon, Hiroki Okayama-ken, JP 13 64
Hayamizu, Naoya Kanagawa-ken, JP 56 460
Hirabayashi, Hideaki Kanagawa-ken, JP 48 589
Kato, Masaaki Okayama-ken, JP 138 1740
Kobayashi, Nobuo Kanagawa-ken, JP 144 1838
Kurokawa, Yoshiaki Kanagawa-ken, JP 43 266
Sato, Nobuyoshi Mie-ken, JP 36 370
TANGE, Makiko Kanagawa-ken, JP 7 80
Yonekura, Yuri Kanagawa-ken, JP 2 15

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