ELECTROSTATIC CHUCK DEVICE AND METHOD FOR DETERMINING ATTRACTED STATE OF WAFER
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United States of America Patent
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N/A
Issued Date -
Jun 16, 2011
app pub date -
Aug 26, 2009
filing date -
Sep 4, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Provided is an electrostatic chuck device including attraction determining means, which enables a quick and accurate recognition of an attracted state of a substrate, and also provided is a method of determining an attracted state of a substrate, which enables a quick and accurate recognition of the attracted state of the substrate in the electrostatic chuck device. The electrostatic chuck device includes: an electrostatic chuck for attracting the substrate, the electrostatic chuck being provided on an upper surface side of a metal base; and attraction determining means for determining the attracted state of the substrate. Further, the method of determining an attracted state of a substrate is used for the electrostatic chuck device including the electrostatic chuck for attracting the substrate, the electrostatic chuck being provided on the upper surface side of the metal base, the method including obtaining, by a heat flux sensor, a flow of heat transferred from the substrate via the electrostatic chuck, to thereby determine the attracted state of the substrate.
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