INTERLAYER INSULATING FILM, INTERCONNECTION STRUCTURE, AND METHODS OF MANUFACTURING THE SAME
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United States of America Patent
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app pub date -
Jan 10, 2011
filing date -
Jun 20, 2005
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Abstract
and is stable, and a wiring structure comprising the same. In an interlayer insulating film comprising an insulating film provided on a substrate layer, the interlayer insulating film has an effective permittivity of not more than 3. The wiring structure comprises an interlayer insulating film, a contact hole provided in the interlayer insulating film, and a metal filled into the contact hole. The insulating film comprises a fluorocarbon film provided on the substrate layer, and a surface of the fluorocarbon film is nitrided.
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