ELECTROLYTIC COPPER COATING, METHOD OF MANUFACTURING THE SAME, AND COPPER ELECTROLYTE FOR MANUFACTURING ELECTROLYTIC COPPER COATING
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United States of America Patent
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Issued Date -
Jun 16, 2011
app pub date -
Jun 12, 2009
filing date -
Jun 12, 2008
priority date (Note) -
Abandoned
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Abstract
An object of the present invention is to provide an electrolytic copper coating that exhibits a bendability and flexibility equal to or better than those of rolled copper foil after the heat history in a circuit board fabrication process, especially after a heat history equivalent to the heat history applied when bonding with a polyimide film. The present invention provides an electrolytic copper coating and a method of manufacturing the same wherein, when performing heat treatment so that the LMP value shown in Equation 1 becomes 9000 or more, the result becomes a crystal distribution of crystal grains, having a maximum length of crystal grains after heat treatment of 10 μm or more, of 70% or more:
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