Heat Transfer Surface for Electronic Cooling
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jun 16, 2011
app pub date -
Dec 21, 2010
filing date -
Jun 7, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A cooling surface for cooling an electronic component, the surface having two sets of fins, each set of fins defining a set of channels, and a number of passageways connecting the sets of channels. The cooling surface can be attached to an electronic component, such as a chip, and refrigerant supplied to at least one of the sets of channels. When the temperature of the electronic component rises, the heat is transferred to the refrigerant in the cooling surface, at least some of which vaporizes to carry heat away from, and facilitate cooling of, the component.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully